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MECH 553 Design and Manufacture of Microdevices (3 credits)

Note: This is the 2020–2021 eCalendar. Update the year in your browser's URL bar for the most recent version of this page, or .

Offered by: Mechanical Engineering (Faculty of Engineering)

Overview

Mechanical Engineering : Introduction to microelectromechanical systems (MEMS). Micromachining techniques (thin-film deposition; lithography; etching; bonding). Microscale mechanical behaviour (deformation and fracture; residual stresses; adhesion; experimental techniques). Materials- and process-selection. Process integration. Design of microdevice components to meet specified performance and reliability targets using realistic manufacturing processes.

Terms: Fall 2020

Instructors: Vengallatore, Srikar (Fall)

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