不良研究所
不良研究所
不良研究所 Nanotools Micro, Nanofabrication Facility
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不良研究所 Nanotools Micro, Nanofabrication Facility
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The Facility
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Equipment
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Getting Started @ 不良研究所 Nanotools
Packaging and Assembly
On this page:
Dicing Saw - DAD3240聽
Wafer Bonder - EVG501聽
Wire Bonder聽
不良研究所
Dicing Saw - DAD3240聽
Cuts wafers into individual die.
Wafer Bonder - EVG501聽
Bonds wafers together: Si-Si, Si-glass, glass-glass.
Wire Bonder聽
Connects die to packages with bonding wire.
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